Fluorine contamination for gold wire bonding
WebJul 26, 2007 · Abstract In this paper, pad contamination sources were summarized and several cases were studied. The fluorine on bond pad was introduced through top metal etch/pad opening process per etch... WebFluorine contamination was characterized on the bonding pads by AES (Auger Electron Spectroscopy) then the wafers were assembled into packages and then tested using THB (Temperature Humidity Biased) stress. Final test after THB stress was the major response for the experiment.
Fluorine contamination for gold wire bonding
Did you know?
Webeffective for many types of contamination such as Fluorine, organic contamination and metal oxides, because it is largely non-selective and removes all these contaminants at a … WebJan 1, 2008 · Fluorine corrosion is detrimental to Al pad quality resulting in nonstick on pad (NSOP). In wafer fabrication, NSOP refers to liftoff of Au wire-bond from the surface of Al bondpad due to its...
WebOct 1, 1994 · Sputter depth profiles indicated that the oxide layer thickness on those band pads, which showed poor gold wire adhesion, was higher than the thickness of the native oxide layer of aluminium. This corrosion was induced by segregation of fluorine into the bulk during storage of the wafers in closed polypropylene boxes. The… View via Publisher WebWe think that the relatively smaller value of the fluorine count compared with the oxygen taken from the sample can dilute the trace existence of aluminum oxide compounds formed on the percentage value of fluorine, and the evidence of larger counts of oxygen certainly explain the formation of Al(OH) x as a hindrance to wire-bonding.
WebGold wire bonded to a gold bond pad is extremely reliable because the bond is not subject to interface corrosion, intermetallic formation, or other bond-degrading conditions. Even a poorly welded gold-gold bond will increase in strength with time and temperature. Gold wire welds best with heat although cold ultrasonic Au-Au wire bonds can be made. WebThe corrosion and oxidation behaviors of Au and Cu wire bonding are determined through soaking in sodium chloride (NaCl) solution and high temperature storage (HTS) at 175 …
WebThe contamination was found to be of the Al (OF) x type, which was initially formed in the CF 4 /O 2 plasma-etching process. On test samples of aluminium metallization that have … fc 76WebMar 1, 2002 · A lot of wedge bonding failures were observed on the leadframe (LF) type A due to non-stick on lead (NSOL) during the second wire bonding process of TQFP … fc755b2whWebMay 1, 2014 · The sources of contamination on bond pads, including fluorine, chlorine, carbon, oxygen, silicon, and titanium, are examined, along with their influence on wire … fc-757at 取説WebDec 1, 1995 · The degradation of gold aluminium ball bonds has been studied by shear tests, resistivity measurements, micrographs, EDX and AES as a function of aging time at elevated temperatures and after various contamination treatments before and … fc7540WebFluorine-Induced corrosion of aluminium microchip bond pads: An XPS and AES analysis. Abstract: X-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy … fc7545WebDec 1, 2011 · Contamination of aluminum bond pads with fluoride or oxide layers have no or minor impact on the gold wire bond quality indicator, i.e. ball shear test. In accelerated … fringe workout equipmentWebFluorine-containing gases are often used in semiconductor fabs as a strong etchant. Fluorine slightly reacts with Al and forms [AlFx] (x-3)- (e.g. [AlF6]3-) or compounds AlxFyOz on the surface of bonding pads. Those compounds can’t be easily washed away from EKC & DI water cleaning processes. f/c70s-3z f/c70s-3